MULTI-LAYER RIGID FLEXIBLE WIRING BOARD, MULTI-LAYER FLEXIBLE WIRING BOARD, AND THOSE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multi-layer rigid flexible wiring board which can reduce a cost and labor without using a cover lay film and is applicable to an environmental problem, a multi-layer flexible wiring board, and those manufacturing method. SOLUTION: In the multi-layer rigid flexible wiring board where a first flexible substrate 3 is used as a core material and a rigid substrate is laminated on the core material through the cover lay, a flexible insulating material having an adhesive function is used instead of the cover lay. COPYRIGHT: (C)2006,JPO&NCIPI