| 摘要 |
A light emitting diode module for a signboard, and an apparatus and a method for manufacturing the same are provided to improve productivity by electrically connecting an electric wire to a printed circuit board having a light emitting diode by a screw. A working table(61) is installed to have a predetermined height on an installation plane. A base member(62) is installed to have a predetermined height on an upper plane of the working table. A lower molding(63) is fixedly installed on an upper plane of the base member, and has a plurality of light emitting diodes. A plurality of position determination holes are formed on a predetermined position of a central part. A couple of cavities having a size and a depth in proportion to a size and a depth of a printed circuit board coupled to an electric wire are formed to have a predetermined interval on the central part of the upper plane. A hot runner is formed from a center plane toward the lower cavity. An upper molding(68) is arranged on an upper part of the lower molding, and is closely adhered to or separated from the lower molding by an oil pressure cylinder. A resin injection hole is formed on a central part. The upper molding has the same size and depth with the lower cavity on a corresponding position to the lower cavity of the lower molding. A plurality of protrusions which cover an upper plane of the light emitting diode are formed on a predetermined position. A couple of upper cavities having a plurality of protrusion units are formed to be coupled by a hot runner coupled to the resin injection hole. An ejector(72) is installed on a bracket installed on an upper part of the upper molding, and supplies an ejecting material of a synthetic resin through the resin injection hole of the upper molding. |
