LED PACKAGE WITH ITS LIGHT EMITTED ALL OVER THE WHOLE SURFACES AND METHOD FOR FABIRCATING THE SAME

摘要

An overall light-emitting type LED package and a method for fabricating the same are provided to perform a function of a decoration light source by emitting light through an entire surface thereof. A plurality of lead electrodes(14a,14b) are formed on a printed circuit board(10). The printed circuit board has a light transmitting characteristic. An LED chip(20) is electrically connected to each lead electrode. The LED chip is mounted on a light transmitting part of the printed circuit board. A sealing agent(40) is formed on the printed circuit board in order to surround a periphery of the LED chip. Each of the lead electrodes is separated from the LED chip and is connected to the electrodes of the LED chip.