| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact and inexpensive cooling device which has a sufficient cooling function for an electronic component large in heat generation. SOLUTION: The cooling device includes a main circuit board 4 mounted with the electronic component 5 generating much heat at an interval with a circuit board surface, and an upper heat sink 2 and a bottom heat sink 3 which face each other across the electronic component 5 generating much heat and come into contact with a good-heat-conductivity sheet type member 6. Further, the heat sinks 2 and 3 are provided with a plurality of heat dissipation fins 7 and 8 projecting in plate shapes toward the opposite heat sinks. Further, those individual fins are disposed having a constant gap with the heat dissipation fins on the opposite sides, and the gaps form a passage for cooling air. Further, a fan motor 1 for cooling the heat dissipation fins 7 and 8 is provided at the top of the respective heat sinks. COPYRIGHT: (C)2009,JPO&INPIT
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