| 摘要 |
PROBLEM TO BE SOLVED: To provide a combined cutting device capable of highly efficiently cutting a substrate and the like. SOLUTION: The combined cutting device 1 is provided with: an alignment means 4 for positioning a substrate 2 on an alignment table 3 and recognizing scribing lines of the substrate 2; a laser processing means 5 for cutting the substrate 2 like a curved line; a dicing means 7 for positioning the substrate 2 on a cutting table 6 and cutting the substrate 2 like a straight line; and a transfer means 8 for transferring the substrate 2 from the alignment table 3 to the cutting table 6. According to the combined cutting device 1, the single substrate 2 is irradiated with a laser beam by the laser processing means 5 and cut by the dicing means 7, so that the single substrate 2 can be divided into a plurality of pieces. COPYRIGHT: (C)2009,JPO&INPIT
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