发明名称 METHOD AND DEVICE FOR HEAT-TREATING
摘要 PROBLEM TO BE SOLVED: To increase the number of substrates loaded on a substrate holding device more than before with a heat-treatment uniformity secured. SOLUTION: A plurality of substrates w to be heat-treated are vertically loaded on the substrate holding device 10 at the predetermined intervals, the substrate holding device 10 is conveyed in a heat-treating furnace 3, and the substrate to be heat-treated is heat-treated in the predetermined manner. The substrate holding device 10 has substrate supporting parts 30 for supporting peripheral portion of the substrate to be treated supported by a plurality of supporting columns 28 vertically at predetermined intervals, and the supporting columns is composed of two holding-device-constituting-bodies 10a, 10b arranged on the same circumference. After the substrate to be treated with its main surface as the top surface is loaded on one holding-device-constituting-body 10a, and the substrate to be treated with its rear surface as the top surface is loaded on the other holding-device-constituting body 10b respectively, the two holding-device-constituting bodies are relatively vertically moved. This arranges the vertically adjacent substrates to be treated with their rear surfaces and their main surfaces alternately placed to make the interval between the main surfaces as an interval pa capable of assuring the treatment uniformity and the interval between the rear surfaces as an interval pb narrower than the interval between the main surfaces. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081258(A) 申请公布日期 2009.04.16
申请号 JP20070249039 申请日期 2007.09.26
申请人 TOKYO ELECTRON LTD 发明人 INOUE HISASHI;MATSUMOTO SHUNICHI;TAKEUCHI YASUSHI
分类号 H01L21/683;C23C16/458;H01L21/31;H01L21/677 主分类号 H01L21/683
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