| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder that can carry out a die-bonding process on a BOC-type electronic component at low cost using a conventional die bonder, as well as, to provide a die-bonding method for the component. SOLUTION: A substrate 1, whose pattern formation surface 1a is turned downward is placed on an upper surface of a transparent member 21, having a mirror member 20 on its lower surface, with the mirror member whose mirror side 20a being turned upward, and by having the inside of the wire insertion hole 17 imaged from above the substrate 1 placed on the upper surface of the transparent member 21; and the reflected image of a substrate-side pattern 2 that is projected onto the mirror surface 20a is acquired and this is perceived through the wire insertion hole 17 and the transparent member 21, and the position of the substrate-side pattern 2 is recognized. COPYRIGHT: (C)2009,JPO&INPIT |
