发明名称 Methods and apparatus for a redundant board assembly
摘要 A redundant pair of interconnected board sub-assemblies have substantially the same dimensions and level of functionality. A module interconnect card is configured to mechanically and electronically connect to the first and second board sub-assemblies. Each sub-assembly is configured (e.g., via a properly configured microcontroller) to compensate for a loss of functionality in the other sub-assembly. Each subassembly preferably includes a re-usable adapter card that interfaces with a first card such that components requiring a lower certification level-e.g., commercial off-the-shelf (COTS) components or the like-may be isolated on the first card, wherein the adapter card includes high certification-level parts and communicates with the first card. The two cards are electronically and mechanically coupled to form the finished board assembly. The interface card may be re-used in a variety of current or future cabinet specifications, including, for example, cabinets manufactured in accordance with the Compact PCI (cPCI) 3U and 6U specifications.
申请公布号 US7599194(B2) 申请公布日期 2009.10.06
申请号 US20050317348 申请日期 2005.12.22
申请人 THE BOEING COMPANY 发明人 SHEFFIELD GREGORY L.
分类号 H05K7/02 主分类号 H05K7/02
代理机构 代理人
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