| 发明名称 |
PROBE POSITION INSPECTION APPARATUS, SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE INSPECTION METHOD |
| 摘要 |
A probe position inspection apparatus capable of inspecting the position of contact portions of respective probe tips easily and accurately, an apparatus for inspecting a semiconductor device, and a method of inspecting a semiconductor device are provided. The probe position inspection apparatus includes a transparent plate, a camera for taking an image of one surface of the transparent plate, and a pressure passive member covering the other surface of the transparent plate. The tip of a probe for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate, with the pressure passive member therebetween. The probe position inspection apparatus further includes an image processor for processing the image taken by the camera to detect the position of the probe in the plane of the transparent plate. |
| 申请公布号 |
US2017102410(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201615206339 |
申请日期 |
2016.07.11 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
TAKESAKO Norihiro;NOGUCHI Takaya;OKADA Akira |
| 分类号 |
G01R1/067;G01R1/04 |
主分类号 |
G01R1/067 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A probe position inspection apparatus comprising:
a transparent plate; a camera for taking an image of one surface of said transparent plate; and a pressure passive member covering the other surface of said transparent plate, wherein the tip of a probe for use in evaluation of a semiconductor device is pressed against said other surface of said transparent plate, with said pressure passive member therebetween, said probe position inspection apparatus further comprising an image processor for processing the image taken by said camera to detect the position of said probe in the plane of said transparent plate. |
| 地址 |
Tokyo JP |
