发明名称 |
IMPROVED METHOD OF SOLDERING |
摘要 |
An improved soldering alloy for soldered joints comprising one or more aluminum members has a base containing lead and bismuth to which is added a small amount of silver or indium. The solder alloy has a low melting point of typically less than 480 DEG F together with very good corrosion resistance. The alloy can also contain relatively small amounts of tin, zinc and antimony.
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申请公布号 |
US3716909(A) |
申请公布日期 |
1973.02.20 |
申请号 |
USD3716909 |
申请日期 |
1972.04.13 |
申请人 |
ALUMINUM CO OF AMERICA,US |
发明人 |
GEIGER R,US;STOKES J,US;CARGNEL R,US |
分类号 |
B23K35/26;(IPC1-7):B23K31/02;B23K35/24 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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