ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTILITY COPPER DEPOSITS

摘要

PROBLEM TO BE SOLVED: To provide acid copper electroplating baths for electroplating low internal stress copper deposits with good ductility.SOLUTION: The acid copper electroplating baths include one or more branched polyalkylenimines represented by formula (I) and one or more accelerators. The acid copper electroplating baths are used to electroplate thin films on relatively thin substrates to form thin film copper deposits having low internal stress and high ductility.SELECTED DRAWING: None