| 摘要 |
1403786 Semi-conductor devices PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 11 Oct 1972 [14 Oct 1971] 46903/72 Heading H1K Contact points 4 on a semi-conductor chip 3, e.g. an I.C. are bonded to the inner ends of conductor tracks 2 located on an insulating foil 1, e.g. of polyimide, the outer ends of the tracks being attached to holding elements on the ends of the flat strip conductors 5 the outer ends of which project from opposite sides of an encapsulation or housing for the chip. The width of the foil exceeds the spacing between opposed pairs of holding elements, causing the foil to bow enabling the uncontacted face of the chip to bear against and if desired, be soldered to a cooling plate embedded in the encapsulation or incorporated in the housing wall. In the embodyment shown in Fig. 2, the holding element consist of claws 7 ,8 formed from the ends of the flat teeth of comb-like conductor structures cut from standard strips of indefinite length. The conductors are held between the engaging rims of thermoplastic housing parts 13, 16 which are welded together, the chip being pressed against a cooling plate 14 moulded or held by a snapfastener in the wall of part 13 by an internal projection 15 from the resilient wall of part 16. The housing may be filled with synthetic resin and the conductive teeth finally severed from the combs and bent up if required for mounting to a printed circuit board. In an alternative embodiment synthetic resin is moulded around the assembly to chip, foil, conductors and cooling plate to form a solid block from which the conductors protrude. |
