| 摘要 |
1446739 Integrated circuits SGS ATES COMPONENTI ELETTRONICI SpA 16 Nov 1973 [16 Nov 1972] 53324/73 Heading H1K A heat sink for an integrated circuit comprises flat copper or aluminium bar 1 with two pins extending from ribs 4 on one surface thereof to a height which is initially greater than that of the eventual encapsulated package. The device is assembled by passing the pins through windows in a lead frame until it rests on shoulders 3, welding the silicon substrate of the I.C. to the bar 1 and applying encapsulant using a mould which compresses the pins to the level of the encapsulated body, thus ensuring that surface 6 of the heat sink is pressed against a mould surface and remains free from encapsulant. At the same time shoulders 3 are deformed to retain the lead frame. The silicon substrate may alternatively be secured to a cradle portion of the lead frame (Fig. 3, not shown) which portion is welded to the metal bar 1. A plurality of I.C.s may be processed in a batch operation. |
