| 摘要 |
1380644 A base for supporting an electrical component PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 10 Jan 1972 [13 Jan 1971] 992/72 Heading B5A [Also in Divisions C1 and H1] A rectangular base for the envelope of an electric component, e.g. a semi-conductor device is formed by placing a preform 5 of heat softenable, insulating material on a pressing member 4 positioned in a T-shaped mould 2, 3, placing a grid of flat conductors shaped as shown on the member 4 so that the legs 8 of the conductors lie between the member 4 and the corresponding mould wall, placing a rectangular metal sleeve 11 in the mould, applying a cover-plate 12, placing the mould in a furnace and urging the member 4 against the preform 5 to force the bent ends 10 of the conductors against the coverplate 12 and the softened material of the preform 5 between the upper parts of the conductors (see Figs. 3, 4) to form a hermetic seal with the sleeve 11. The sleeve 11 may be provided with a flange for welding to a lid. A metal plate 7 which may be positioned in a recess 6 in the preform 5 may be provided. The preform 5 may be synthetic resin or crystallized or uncrystallized glass which may be preformed by sintering into the rectangular block shown. The conductors may be formed by etching or punching a metal strip and may have straight or bent legs 8 (Fig. 4). One or more bases may be formed at a time. To form several bases simultaneously, a series of interconnected conductor grids (24, Fig. 7) is laid in a multi-cavity graphite mould. |
