Cooling system for electronics

摘要

A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

主权项

1. A method for conveying heat away from an electronic component, the method comprising:
positioning an interior portion of a conformable thermal interface sleeve over the electronic component in an installed position, whereby the interior portion embraces both a first side surface of the electronic component and a second side surface of the electronic component; positioning a first angular surface of a first heat conducting wedge against a first angular outer surface of the conformable thermal interface sleeve; positioning a first ridge located on the first angular outer surface of the conformable thermal interface sleeve into fitted alignment with a first mating groove located on the first angular surface of the first heat conducting wedge; positioning a second angular surface of a second heat conducting wedge against a second angular outer surface of the conformable thermal interface sleeve; positioning a second ridge located on the second angular outer surface of the conformable thermal interface sleeve into fitted alignment with a second mating groove located on the second angular surface of the second heat conducting wedge; positioning a first thermal channel adapted to conduct heat away from the first heat conducting wedge in contact with the first heat conducting wedge; positioning a second thermal channel adapted to conduct heat away from the second heat conducting wedge in contact with the second heat conducting wedge; and positioning a manifold in contact with the first thermal channel and the second thermal channel.