CIRCUIT MATERIALS AND ARTICLES FORMED THEREFROM

摘要

Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a Df of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.

主权项

1. A circuit material, comprising a dielectric layer comprising a polymer component, wherein the polymer component comprises:
a continuous polymeric matrix; and particles comprising a poly(triallyl isocyanurate), a poly(triallyl cyanurate), a copolymer comprising at least one of the foregoing, or a combination comprising at least one of the foregoing, wherein the particles are dispersed in the continuous polymeric matrix; and wherein the circuit material has a Df of less than 0.0060 at 10 GHz, preferably less than 0.0040 at 10 GHz, more preferably less than 0.0030 at 10 GHz, and a Dk of less than 3.8 at 10 GHz.