发明名称 |
CONDUCTIVE FILM-FORMING BATH |
摘要 |
An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexinq agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure. |
申请公布号 |
US2016273118(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201415034424 |
申请日期 |
2014.11.18 |
申请人 |
OKUNO CHEMICAL INDUSTRIES CO., LTD. |
发明人 |
Takeuchi Yukiya;Yoshikawa Junji;Kita Koji |
分类号 |
C25D3/38;C25D3/04;C23C18/16;C25D3/12 |
主分类号 |
C25D3/38 |
代理机构 |
|
代理人 |
|
主权项 |
1. A conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure. |
地址 |
Osaka-shi, Osaka JP |