| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer fixing tape excellent in both heat resistance against plasma and expandability at the time of pickup, in the processing of a semiconductor wafer using the plasma dicing, and to provide a processing method of a semiconductor wafer, and a semiconductor chip.SOLUTION: In a wafer fixing tape having an adhesive layer on a base material film, the base material film contains ionomer resin produced by crosslink a three-dimensional copolymer with metal ions, and the arithmetic average roughness Ra of the base material film surface on the side opposite from the adhesive layer 5b is 0.1-3.0 μm.SELECTED DRAWING: Figure 2 |
