发明名称 GLASS SUBSTRATE WITH EMBEDDED SILICON WIRING AND SENSOR USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a small-sized glass substrate with embedded silicon wiring and a sensor using the glass substrate.SOLUTION: The glass substrate with embedded silicon wiring, includes: a glass substrate which has a first plane and a second plane opposite to the first plane; and silicon wiring which is embedded in the glass substrate. The silicon wiring has a first part which extends perpendicular to the first plane and a second part which extends in parallel with the first plane. The width of the end part of the second part closer to the first plane is narrower than the width of the end part of the second part closer to the second plane.SELECTED DRAWING: Figure 3
申请公布号 JP2016170099(A) 申请公布日期 2016.09.23
申请号 JP20150050832 申请日期 2015.03.13
申请人 PANASONIC IP MANAGEMENT CORP 发明人 EDA KAZUO;YOSHIDA HITOSHI;AOYAGI TAKANORI
分类号 G01P15/08;B81B7/02;G01P15/125;H01L23/14;H01L23/15;H01L29/84;H05K1/02 主分类号 G01P15/08
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