THIN HEAT DISSIPATION FOIL AND METHOD FOR MANUFACTURING SAME

摘要

A thin heat dissipation foil includes a first copper foil, a second copper foil, a plurality of bonding blocks and a working fluid. The first copper foil includes a first bonding surface, the first bonding surface defines a plurality of first receiving cavities and a plurality of first bonding recesses surrounding the first receiving cavities. The second copper foil includes a second bonding surface, the second bonding surface defines a plurality of second receiving cavities corresponding to each of the first receiving cavities. Each bonding block is located in the first bonding recess. The bonding block is configured to bond the first bonding surface and the second bonding surface to form a seamless interface, and each first receiving cavity and each second receiving cavity together form a vacuum tube. The working fluid is received in the vacuum tube.

主权项

1. A thin heat dissipation foil comprising:
a first copper foil comprising a first bonding surface defining a plurality of first receiving cavities and a plurality of first bonding recesses; a second copper foil comprising a second bonding surface defining a plurality of second receiving cavities corresponding to each of the first receiving cavities; a plurality of bonding blocks being located in the first bonding recess and being configured to bond the first bonding surface and the second bonding surface and to form a seamless interface, wherein each of the plurality of first receiving cavities and each second receiving cavities together define a vacuum tube; and a working fluid received in the vacuum tube.