| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency semiconductor package capable of improving performance.SOLUTION: A high frequency semiconductor package is equipped with a conductive housing, and a feed through equipped with signal wiring patterns and ground wiring patterns. The signal wiring patterns are provide so as to penetrate the housing, be exposed in the inside and outside of the housing, be insulated from the housing. The ground patterns are provided so as to be exposed in the inside and outside of the housing, and sandwich the signal wiring pattern therebetween. The ground wiring patterns are divided into first ground wiring patterns exposed on the outside of the housing so as not to exist in an area surrounded by a housing metallic wall, and second ground wiring patterns exposed in the inside of the housing.SELECTED DRAWING: Figure 2 |
