| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional structure formation device which can perform three-dimensional processing of an object, such as a semiconductor material, accurately, and to provide a method of manufacturing an object.SOLUTION: A three-dimensional structure formation device includes a holding mechanism, a transfer plate, a moving device, and a supply device. The holding mechanism holds an object. The transfer plate has a surface formed in a transfer shape to be transferred to the object held by the holding mechanism, and has a catalyst layer formed on the surface of the transfer shape, and a restricting portion abutting against the object or holding mechanism. The moving device moves the transfer plate and object relatively in the opposite directions. The supply device supplies an etching liquid for etching the object by reacting on the catalyst between the object and catalyst layer.SELECTED DRAWING: Figure 1 |
