发明名称 |
SCALABLE LIQUID SUBMERSION COOLING SYSTEM |
摘要 |
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems. |
申请公布号 |
EP3072374(A1) |
申请公布日期 |
2016.09.28 |
申请号 |
EP20140864561 |
申请日期 |
2014.11.21 |
申请人 |
LIQUIDCOOL SOLUTIONS, INC. |
发明人 |
SHAFER, STEVE;ARCHER, SEAN;ROE, DAVID, ALAN;TUFTY, LYLE, R. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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