| 发明名称 |
POLYETHYLENE COMPOSITION FOR PACKAGING WITH IMPROVED HEATTSEALING PROP ERTIES |
| 摘要 |
PURPOSE:Title composition comprising a high-density polyethylene and a specific polyamide, with excellent impact resistance, tear strength transparency, etc. and improved heat-sealing properties. |
| 申请公布号 |
JPS5293457(A) |
申请公布日期 |
1977.08.05 |
| 申请号 |
JP19760009227 |
申请日期 |
1976.02.02 |
| 申请人 |
SHOWA DENKO KK;SHOWA YUKA KK |
发明人 |
MATSUOKA MASAMI;MINOURA TAKASHI;AOYANAGI TERU;TAKA TOSHIO |
| 分类号 |
C08L23/00;B65D65/00;C08J5/18;C08L23/04;C08L23/06;C08L77/00;C08L77/08;C08L101/00 |
主分类号 |
C08L23/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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