| 发明名称 |
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE CLIP WITH FLEXIBLE LEADS AND RELATED METHODS |
| 摘要 |
An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the first surface. The IC device may further include a conductive clip including a first portion coupled to the second surface of the IC die, a second portion coupled to the first portion and extending laterally away from the IC die, and at least one flexible lead coupled to the second portion and looping back under the second portion toward the leadframe. Furthermore, a package may be over the leadframe, IC die, and conductive clip and have an opening therein exposing the at least one flexible lead. |
| 申请公布号 |
US2016293523(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201514674069 |
申请日期 |
2015.03.31 |
| 申请人 |
STMICROELECTRONICS, INC. |
发明人 |
Talledo Jefferson;Cadag Ela Mia |
| 分类号 |
H01L23/495;H01L21/48;H01L21/56;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (IC) device comprising:
a leadframe; an IC die having a first surface coupled to said lead frame, and a second surface opposite the first surface; a conductive clip comprising
a first portion coupled to the second surface of said IC die,a second portion coupled to the first portion and extending laterally away from said IC die, andat least one flexible lead coupled to the second portion and looping back under the second portion toward said leadframe; and a package over said leadframe, IC die, and conductive clip and having an opening therein exposing the at least one flexible lead at a bottom of the package, and the package enclosing the first and second portions and the at least one flexible lead so that they are not exposed on sides or a top of the package. |
| 地址 |
Calamba City PH |
