SEMICONDUCTOR DEVICE PACKAGES

摘要

A semiconductor device package that incorporates a combination of ceramic, organic, and metallic materials that are coupled using silver is provided. The silver is applied in the form of fine particles under pressure and a low temperature. After application, the silver forms a solid that has a typical melting point of silver, and therefore the finished package can withstand temperatures significantly higher than the manufacturing temperature. Further, since the silver is an interfacial material between the various combined materials, the effect of differing material properties between ceramic, organic, and metallic components, such as coefficient of thermal expansion, is reduced due to low temperature of bonding and the ductility of the silver.

主权项

1. A semiconductor device comprising:
an insulative frame having a top surface and a bottom surface; a base plate having a top surface with an interface region; and sintered silver between the bottom surface of the insulative frame and the interface region on the top surface of the base plate, wherein the sintered silver directly couples the bottom surface of the insulative frame to the top surface of the flange.