| 发明名称 |
Free-Edge Semiconductor Chip Bending |
| 摘要 |
Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending. |
| 申请公布号 |
US2016293429(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201514677697 |
申请日期 |
2015.04.02 |
| 申请人 |
Microsoft Technology Licensing, LLC |
发明人 |
Keefe Andrew;McKnight Geoffrey P.;Herrera Guillermo |
| 分类号 |
H01L21/304;H01L23/13;H01L23/00 |
主分类号 |
H01L21/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
placing a substantially flat semiconductor chip on a recessed surface of a mold such that corners or edges of the semiconductor chip are substantially unconstrained; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward a bottom of the recessed surface, wherein the substantially unconstrained corners or edges of the semiconductor chip move with respect to the recessed surface during the bending. |
| 地址 |
Redmond WA US |
