| 摘要 |
A tool for testing the miniaturized circuitry of silicone wafer devices. A ring-shaped structure is supported on a casting or platform for movement along X and Z axes in a horizontal plane. A probe is suspended from the ring-shaped element for contact with a lead-in point of the circuitry on the device to be tested. The probe may be moved along the X and Z horizontal axes and a Y vertical axis relative to the ring, movement in the X and Z axes being controlled by a single lever which acts between the ring and the probe. Movement of the probe in the Y axis is controlled by a screw-type pressure-exerting device which also serves as a pivot point for movement of the probe along the horizontal axes. A high performance board is supported on the ring to act as a junction board so that the probes may be connected to a cable which runs around the ring. The cable extends radially therefrom at a location such that it may be connected to suitable external control circuitry.
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