Glass-moulded type semiconductor device

摘要

A semiconductor device according to the present invention comprises a silicon pellet adhesively fixed with a soft solder between a pair of leads provided with headers and having a thermal expansion coefficient greatly different from those of the silicon pellet and mould glass. An assembly including the silicon pellet is then glass-moulded to provide semiconductor device. The leads are provided with a film having low wetness to glass for preventing a breakage of the mould glass due to the difference between the thermal expansion coefficients.