| 摘要 |
A controlled impedance connector for providing a high density controlled impedance interface between a computer backplane and printed circuit (PC) logic card circuitry having signal carrying conductors and a ground surface imbedded in a dielectric medium at selected spacings to achieve a desired characteristic impedance. A common ground surface is provided for a plurality of signal conductors which are in a selected geometrical relationship with the ground surface. Another embodiment of the invention uses a plurality of microstrips embedded in a dielectric medium and dielectrically separated from a common ground surface to achieve the desired characteristic impedance.
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