发明名称 |
Bonding copper leads to gold film coatings on alumina ceramic substrate |
摘要 |
A process for thermocompression bonding a copper wire lead to gold film on alumina ceramic substrate by use of a gold interface. The three step process involves: (1) thermocompressing a gold lead with a die-formed head to the gold film, (2) removing the gold lead to form a gold die-formed head bonding pad, and (3) thermocompressing the copper lead to the gold die-formed head bonding pad.
|
申请公布号 |
US4096983(A) |
申请公布日期 |
1978.06.27 |
申请号 |
US19770786389 |
申请日期 |
1977.04.11 |
申请人 |
E-SYSTEMS, INC. |
发明人 |
BEILEIN, LORAINE F.;BURKETT, JR., FRANK S. |
分类号 |
B23K20/02;B23K31/00;H01L21/603;H01R43/02;(IPC1-7):B23K31/02 |
主分类号 |
B23K20/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|