发明名称 MANUFACTURE OF WIRING OF ELECTRONIC PARTS
摘要 PURPOSE:The step difference patts of a wiring pattern is reduced as possible to obtain flat wiring and the crack and cut step of the insulating film protecting the wiring is eliminated, so that it will be made possible to manufacture the high-performance and highly reliable wiring.
申请公布号 JPS5396686(A) 申请公布日期 1978.08.24
申请号 JP19770010676 申请日期 1977.02.04
申请人 发明人
分类号 H05K3/46;H01L21/302;H01L21/3063;H01L21/3205;H05K3/00 主分类号 H05K3/46
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