Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto

摘要

An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

主权项

1. An interconnect module, comprising:
a metal clip comprising a first end section, a second end section and a middle section extending between the first and the second end sections, the first end section being configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier, the second end section being configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier; and a magnetic field sensor secured to the metal clip, the magnetic field sensor operable to sense a magnetic field produced by current flowing through the metal clip.