ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

An electronic device includes a first drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element formed thereon, and a second substrate (a sealing plate) bonded to the first drive substrate, a bonding resin forms an accommodating space that surrounds and accommodates a drive region of the piezoelectric element between the first substrate and the second substrate, and a reinforced resin that supports the first substrate and the second substrate in a position deviated from the drive region in the accommodating space.

主权项

1. An electronic device comprising:
a first substrate and a second substrate which are bonded through a bonding resin having photosensitivity, the first substrate including a drive element, that deforms a drive region, provided in the drive region for which flexural deformation is acceptable, and the second substrate being provided and spaced from the first substrate by interposing the drive element and a structure related to driving of the drive element therebetween, wherein the bonding resin forms an accommodating space that surrounds and accommodates the drive region, between the first substrate and the second substrate, and wherein a supporting portion, that supports the first substrate and the second substrate, is formed at a position deviated from the drive region, in the accommodating space.