| 发明名称 |
Reinforced structure for a stack of layers in a semiconductor component |
| 摘要 |
The present application relates to a reinforcing structure for reinforcing a stack of layers in a semiconductor component, wherein at least one reinforcing element having at least one integrated anchor-like part, is provided. The basic idea is to reinforce bond pad structures by providing a better mechanical connection between the layers below an advanced underbump metallization (BUMA, UBM) by providing reinforcing elements under the UBM and/or BUMA layer. |
| 申请公布号 |
US9466579(B2) |
申请公布日期 |
2016.10.11 |
| 申请号 |
US200812670484 |
申请日期 |
2008.07.17 |
| 申请人 |
NXP B.V. |
发明人 |
Hochstenbach Hendrik Pieter;Van Driel Willem Dirk |
| 分类号 |
H01L23/48;H01L23/00;H01L23/31;H01L23/522;H01L23/528;H01L23/532 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor component comprising:
a stack of layers, and at least one reinforcing structure having at least one integrated anchor-like part in an interconnect structure of metallization layers and dielectric layers, the at least one reinforcing element being configured and arranged to mitigate delamination of the metallization and dielectric layers, wherein the stack of layers includes at least one metal layer and at least one dielectric layer, characterized in that at least one metal layer is connected to at least one dielectric layer by the at least one reinforcing structure. |
| 地址 |
Eindhoven NL |
