发明名称 Semiconductor chip and stack type semiconductor apparatus using the same
摘要 A semiconductor may include a core block configured to store and output data, and may be configured to output internal information. The semiconductor may include a through via configured for signal transfer with another semiconductor chip. The semiconductor may include an internal information processing circuit configured to transmit internal information selected from the internal information to the through via, or may be configured to output internal information of the other semiconductor chip, which has been transmitted through the through via, to an exterior through a special purpose pin, in response to test signals.
申请公布号 US9466555(B2) 申请公布日期 2016.10.11
申请号 US201514624720 申请日期 2015.02.18
申请人 SK HYNIX INC. 发明人 Lee Jae Seung;Yoon Byung Kuk
分类号 H01L25/065;H01L23/48;H01L27/118 主分类号 H01L25/065
代理机构 William Park & Associates Ltd. 代理人 William Park & Associates Ltd.
主权项 1. A semiconductor chip comprising: a core block configured to store and output data, and configured to output internal information; a through via configured for signal transfer with another semiconductor chip; an internal information processing circuit configured to transmit internal information selected from the internal information to the through via, or configured to output internal information of the other semiconductor chip transmitted through the through via, to an exterior through a special purpose pin, in response to test signals; and input/output pads configured for inputting and outputting data between the core block and an exterior of the semiconductor chip.
地址 Icheon-Si KR