Semiconductor module

摘要

A semiconductor module has a structure in which a semiconductor device, an insulating sheet, and a cooler are stacked on each other. The semiconductor device includes a semiconductor element, a heat transfer plate that is connected to the semiconductor element, and a resin molding that seals the semiconductor element and the heat transfer plate. A side surface of the resin molding is inclined away from a center of the resin molding relative to a perpendicular direction to a contact surface of the resin molding that is in contact with the insulating sheet. An angle of inclination of the side surface relative to the perpendicular direction is 3 degrees or larger and 17 degrees or smaller.

主权项

1. A semiconductor module comprising a semiconductor device; an insulating sheet; and a cooler, wherein
the semiconductor device, the insulating sheet, and the cooler are stacked on each other, the semiconductor device comprises a semiconductor element, a heat transfer plate connected to the semiconductor element, and a resin molding sealing the semiconductor element and the heat transfer plate, the resin molding comprises a contact surface that is in contact with the insulating sheet and a side surface that extends away from the insulating sheet, the heat transfer plate is exposed on a part of the contact surface, the side surface of the resin molding is inclined away from a center of the resin molding relative to a perpendicular direction to the contact surface, and an angle of inclination of the side surface relative to the perpendicular direction is 3 degrees or larger and 17 degrees or smaller.