发明名称 Method of forming target patterns
摘要 A method of forming target patterns is disclosed. A substrate with multiple fins is provided. A plurality of mask patterns is formed across the fins and in at least a part of non-target areas. Target patterns are formed respectively in trenches between the mask patterns. The mask patterns are removed. With the disclosed method, the target patterns can be formed with substantially equal thickness. In the case that the target patterns are dummy gates, the conventional defects such as dummy gate residues or gate trench widening caused by uneven thicknesses are not observed upon the dummy gate removal step.
申请公布号 US9466535(B2) 申请公布日期 2016.10.11
申请号 US201514636940 申请日期 2015.03.03
申请人 United Microelectronics Corp. 发明人 Huang Po-Cheng;Li Kun-Ju;Li Yu-Ting;Lin Chih-Hsun
分类号 H01L29/66;H01L21/8234;H01L21/033;H01L21/306 主分类号 H01L29/66
代理机构 J.C. Patents 代理人 J.C. Patents
主权项 1. A method of forming target patterns, comprising: providing a substrate with multiple fins; forming a plurality of mask patterns across the fins and in at least a part of non-target areas; forming target patterns respectively in trenches between the mask patterns; and removing the mask patterns, wherein the target patterns are dummy gates.
地址 Hsinchu TW