| 摘要 |
The present invention relates to a desoldering tool or device especially intended for desoldering electrical connections of the type used for supporting components in printed circuit boards. The device includes a heating element for melting the solder connection by contact therewith and a vibrating mechanism which relatively moves the two conductive elements defining the connection during the course of cooling of the melted joint whereby, upon completion of cooling, the component is essentially free of mechanical connection to its former receptacle. The invention further relates to the method of desoldering which involves melting a soldered connection and relatively vibrating the theretofore connected components during cooling of the solder, especially by pressure exerted on one of the connectors by a vibratable heating member.
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