发明名称 液体吐出装置
摘要 There is provided a liquid ejection device capable of applying a high quality curable composition stably and efficiently by heating the curable composition to a temperature at which the curable composition can be ejected from a head, in a short time without heating the curable composition rapidly and excessively. This liquid ejection device (1) is provided with: a first tank (2) for retaining a liquid composition; a head (3) for ejecting the liquid composition; a first heating means (4) for heating the liquid composition within the first tank (2); a first channel (5) for supplying the liquid composition from the first tank (2) to the head (3); a second heating means (6) for heating the liquid composition passing through the first channel (5) at a heating temperature higher than that of the first heating means (4); a second channel (7) for returning the liquid composition from the head (3) to the first tank (2); a second pump (8) that is provided on the first channel (5); and a first pump (9) that is provided on the second channel (7), wherein the temperature difference between the heating temperature of the second heating means (6) and the heating temperature of the first heating means (4) is 65° C. or less.
申请公布号 JP6023350(B2) 申请公布日期 2016.11.09
申请号 JP20150548091 申请日期 2015.09.18
申请人 積水化学工業株式会社 发明人 上田 倫久;本田 真澄;森本 直之;井上 孝徳;渡邉 貴志;濱田 大地;高橋 良輔
分类号 B05C11/10;B05D3/00;B05D7/24;B41J2/18 主分类号 B05C11/10
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