Systems and methods for conforming test tooling to integrated circuit device profiles with ejection mechanisms

摘要

A test pusher assembly, useful in association with a thermal control unit used to maintain a set point temperature on an integrated circuit device under test, is provided with ejection mechanisms configured to facilitate the disengagement of the DUT at the end of the test. One example of the ejection mechanisms is to provide the substrate pusher assembly with spring-loaded pins that can push the substrate of the DUT away from the pedestal at the end of the test. Another example of the ejection mechanisms is to use a pressurized fluid that can push the substrate of the DUT away from the pedestal at the end of the test.

主权项

1. An integrated circuit (IC) tester assembly with a thermal control unit (TCU) configured to maintain a set point temperature and set force on an integrated circuit device under test (DUT), and configured to conform to a profile of the DUT, the DUT tester assembly comprising:
a test socket assembly including:
a test socket with an opening configured to accommodate an IC device under test (DUT);a pusher extension having an opening to accommodate a pedestal of the thermal control unit;a pusher base configured to provide support to the pusher extension and operatively coupled to the pusher extension; anda set of independently actuatable ejectors configured to conform to a profile of the DUT, substantially housed inside the pusher extension and further configured to directly disengage the DUT from the pedestal at the end of the test; and a thermal control unit including:
a pedestal assembly comprising a heat-conductive pedestal having a bottom end configured to contact the DUT and a temperature sensor in the bottom end for monitoring the temperature of the DUT;a temperature-control fluid circulation block having a fluid inlet and a fluid outlet configured to circulate a fluid therethrough, the block in stacked relationship along a z-axis with the heat conductive pedestal;a thermally-conductive heater between the heat-conductive pedestal and the fluid circulation block configured to provide heat to the pedestal, and further configured to transfer heat from the pedestal to the fluid circulation block; anda controllable force distributor configured to receive a z-axis force and controllably distribute such z-axis force between the pedestal assembly and the test socket assembly.