| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that cracks are easily caused in an upper side solder resist layer that covers the outer periphery of an SMD type pad.SOLUTION: A printed wiring board of an embodiment has a mounting area formed by a first area ER1 and a second area ER2 surrounding the first area ER1. Pads in the first area ER1 are an SMD type, and pads located at four corners of the mounting area are an NSMD type.SELECTED DRAWING: Figure 1 |
