| 摘要 |
PROBLEM TO BE SOLVED: To provide a device capable of pick up depending on an adhesion state of a semiconductor piece and a holding member; and provide a manufacturing method of the device.SOLUTION: A pickup device 100 of the present embodiment includes: a stage 110 on which an adhesive tape 30 where a substrate W in a state of being singulated in semiconductor pieces is held; a push-up unit 120; a collet 130; an upper imaging camera 140; and a lower imaging camera 150. An adhesion state of rear faces of the semiconductor pieces 10 are detected based on imaging data of the lower imaging camera 150, a push-up amount or suction pressure of the push-up unit 120 is adjusted based on the detection result, and pickup of the semiconductor pieces 10 is performed by the collet 130.SELECTED DRAWING: Figure 1 |
