| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin-based composition showing a curing behavior (pan bottom viscosity curve curing behavior) with low viscosity at an early stage of heating and a steep thermal time hardness rising at curing, irrespective of the type of a curing accelerator.SOLUTION: An epoxy resin-based composition comprising epoxy resin, a curing agent (excluding acid anhydride), and a curing accelerator is blended with organic acid or acid anhydride to obtain a resin composition showing the pan bottom viscosity curve curing behavior.SELECTED DRAWING: None |
