发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To accurately align a main pattern with a main buried layer in a semiconductor device by displacing only an auxiliary aligning pattern beforehand for an auxiliary buried layer at predetermined distance in the same direction with respect to the other element pattern. CONSTITUTION:When pattern 7, 7' for a buried layer are aligned in the next step through an epitaxial layer, a pattern which is displaced by a distance DELTAx=kXtepi in the same direction as the direction of b of an aligning pattern 7' shown beforehand for a buried layer 1' with respect to the other element pattern is employed, where tepi represents the thickness of an epitaxial layer, and k represents approx. 0.5-1.0. When the buried layer pattern 2' on the surface of the epitaxial layer is merely accurately aligned in this manner with the aligning pattern 7', the buried layer 1 can be accurately aligned with the other pattern 7.
申请公布号 JPS568817(A) 申请公布日期 1981.01.29
申请号 JP19790085153 申请日期 1979.07.04
申请人 NIPPON ELECTRIC CO 发明人 SUGANUMA TOORU;TAKASHIMA ISAMU
分类号 C23C14/04;H01L21/027;H01L21/205 主分类号 C23C14/04
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