| 摘要 |
PURPOSE:To shorten the steps of forming a projection made of a conductor layer for electrically connecting with the semiconductor element on a tape carrier and eliminate the isolation of a surface resist by executing the surface resist coating step after a back surface patterning step when forming the projection thereon. CONSTITUTION:Conductor layers 20 are coated and etched on a region of an insulating tape carrier 1 provided with conveying sprocket holes 5 at both side edges to form a connecting terminal 22 as below. That is, a conductor layer 20 made of copper foil or the like is coated on the respective regions of the carrier 1, a resist layer is formed on the back surface thereof, is patterned to form a mask 4 of the resist layer through the opening of the carrier 1. Thereafter, a protective resist layer 30 is coated on the surface of the conductor layer 20, is etched from the back surface to form a projection 21 on the layer 20. Thereafter, the layer 30 is modified to a resist layer 31 having predetermined pattern, the protective resist layer 60 is buried in the opening, is etched from the surface, the conductor layer 20 is retained as a connecting terminal 22 containing the projection 21, and the layer 60 is removed. |
