| 发明名称 | Solid-state imaging apparatus and method of manufacturing the same | ||
| 摘要 | A solid-state imaging apparatus includes: an imaging section having a light-receiving portion for receiving light from an object to image the object; and a substrate on which the imaging section is disposed, wherein a predetermined member provided on the substrate in the neighborhood of the light receiving portion is partially or entirely coated in black. | ||
| 申请公布号 | US9478573(B2) | 申请公布日期 | 2016.10.25 |
| 申请号 | US201213352846 | 申请日期 | 2012.01.18 |
| 申请人 | Sony Corporation | 发明人 | Shimizu Masahiko;Iwafuchi Toshiaki |
| 分类号 | H01L27/146;H01L23/00 | 主分类号 | H01L27/146 |
| 代理机构 | Chip Law Group | 代理人 | Chip Law Group |
| 主权项 | 1. A solid-state imaging apparatus comprising: an imaging section having a light-receiving portion configured to receive light from an object to image the object; a substrate on which the imaging section is disposed; and one or more bonding wires, connecting the substrate and the imaging section, located in a range on the substrate where light from the object impinges, wherein the one or more bonding wires are partially or entirely coated with black ink. | ||
| 地址 | Tokyo JP | ||