| 摘要 |
PURPOSE:To enhance the mounting property or integration of the semiconductor device by fixing a lead wire through solder to a noble metal layer coated on a metallized layer surface selectively formed with an insulator and covering the surfaces of the lead wire and the solder with a metallic layer, thereby covering the metal only on the necessary part. CONSTITUTION:The metallized layer 2 is formed on an insulating substrate 1 made of ceramic or the like, and the noble metal layer 4 made of gold, silver or the like is formed, for example, thereon by an electroless plating process. The metallic lead wires 6 are fixedly connected through the solder 5. The surfaces of the lead wires and the solder are covered by a mounting metal plating layer 13. Since this eliminates an Ni plating or sintering for soldering, it increases the mounting property or integration of the semiconductor device and simultaneously obtains an inexpensive semiconductor container. |
