CAVITY PRESSURE MODIFICATION USING LOCAL HEATING WITH A LASER

摘要

A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.

主权项

1. A method for changing a pressure within at least one enclosure in a microelectromechanical systems (MEMS) device, the method comprising:
applying a laser through one of at least two substrates onto a material that changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by a MEMS substrate and a complementary metal-oxide-semiconductor (CMOS) substrate of the at least two substrates, and wherein the material is disposed on a metal layer of at least one of the MEMS substrate or the CMOS substrate; and reflecting at least a portion of incident laser light from the laser with the metal layer back onto the material.