| 摘要 |
PURPOSE:To remove some leaked resin without damaging the exposed part by a method wherein some films for preventing close adhering of resin are selectively arranged outside the resin sealed body. CONSTITUTION:Si resin film 6 is arranged at the outer exposed portion of the lead 3 before the resin is sealed, and the film 6 is sealed by epoxy resin, resulting in producing the exposed part 5. Si solvent is applied to provide a selective removal of the protective film 6, resulting in that a clearance 7 is formed between the exposed part 5 and the lead 3. Thus, the exposed resin part 5 may easily be removed by blast etc. and no damage is made at the exposed part of the device. |
